For AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.
In this webinar, you'll learn about:
- High bandwidth memory (HBM) standard evolution and recent announcements
- Packaging technology for HBM integration
- Silicon interposer design considerations
- HBM2/2E design case studies
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