Webinar

Memory Bandwidth Races Higher with HBM3

Available On-demand

Anytime

Your Desk!

Watch Webinar

First Name

Last Name

Business Email

Company

Country

State

Job Title

Market

I agree to receive communications from Rambus. By ticking this box you approve of receiving communication from Rambus. We need this approval in order to send you the requested content, as well as other content that may be of interest to you. You may unsubscribe from these communications at any time.

I agree to allow Rambus to store and process my personal data. By ticking this box you allow Rambus to store and process your personal data so we are able to send you the mentioned communications.

Comments

View our privacy policy for details on use and storage of your personal data.

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3 memory subsystem can help designers unleash the full power of their HBM3-enabled accelerators and SoCs.

In this webinar, you will learn:

Capabilities of HBM3 memory
Design considerations for HBM3 2D/3D implementations
Features of the Rambus HBM3 Memory Interface Subsystem

Speakers

Frank Ferro

Senior Director, Product Marketing, Rambus

Frank Ferro is the senior director of product management at Rambus Inc. responsible for memory interface IP products. Having spent more than 20 years at AT&T, Lucent and Agere Systems, he has extensive experience in wireless communications, networking and consumer electronics fields. Mr. Ferro holds an executive MBA from the Fuqua School of Business at Duke University, an M.S. in computer science and a B.S.E.T. in electronic engineering technology from the New Jersey Institute of Technology.