Chiplets are a growing trend within the semiconductor industry. And to many, represent a paradigm change for chip designers and chip consumers alike. Rather than a traditional single piece of monolithic silicon with many functions and features, a chiplet contains one or a very limited set of functions and features. Multiple chiplets are then assembled into a MCM (multi-chiplet module). Chiplets can offer multiple advantages over monolithic silicon. Learn the advantage and challenges, along with recommendations for the industry’s successful deployment of heterogenous chiplets.
Download this white paper to learn:
- Challenges of chiplets -- both business and technical
- Die-to-die (D2D) interface types
- Packaging innovations
- Security challenges
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