HBM3 is a high-performance memory that delivers exceptional bandwidth at reduced power and in a compact footprint. It utilizes 3D memory and a 2.5D architecture with a wide interface to deliver high throughput at a high bandwidth-per-watt efficiency for AI/ML and HPC applications.

The Rambus HBM3 PHY supports data rates up to 8.4 Gbps per data pin. The interface features 16 independent channels, each containing 64 bits for a total data width of 1024 bits. The resulting bandwidth is 1075.2 GB/s per stack, with the stack consisting of 2, 4, 8, 12 or 16 DRAMs. Together with the Rambus HBM3 Controller it comprises a complete HBM3 memory subsystem.

Download this brief to:

  • Review the HBM3 Memory Subsystem block diagram
  • Learn the HBM3 PHY features
  • See the offered deliverables

Download the Rambus HBM3 PHY Product Brief