AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new heights. Designers can realize new levels of performance with the HBM3-ready memory subsystem solution from Rambus.
Download this white paper to:
- Evolution of HBM standard
- Design challenges and considerations
- Features of Rambus HBM3-ready memory subsystem